The following models for different applications are available:

Model 4300
small work area epoxy die bonder with one Cognex^TM pattern recognition system for single-chip, multi-placement applications on leadframes (e. g. ICs or LEDs) or smart card tapes.

Model 4300P
small work area, single-chip soft-solder die bonder with one Cognex^TM pattern recognition system for power devices. Bridge attach system and inline reflow oven are optionally available.

Model 4400
high accuracy, large work area epoxy die bonder with three Cognex^TM pattern recognition systems for single-chip, multi-placement applications on leadframes, PCBs, boats/carriers or substrates. Model 4400 can be fitted with either epoxy stamping and/or epoxy dispenser. It is ideal for applications such as SAW filters, Micro-X devices or BGAs.

Model 4500
high accuracy, large work area epoxy die bonder with three Cognex^TM pattern recognition systems for multi-chip, multi-placement applications on leadframes, PCBs, boats/carriers or substrates. Up to 40 different dice can be placed in a single pass through the machine. Die input can be from wafers with up to 8" (ring and/or frame fixture), waffle-packs or gel-packs. Model 4500 can be fitted with up to 6 epoxy stamping tools, up to 2 epoxy dispensers and up to 6 pick & place tools. It is ideal for applications such as hybrids, chip on board (COB), laser LEDs or DVD pickup heads.

Flip-Chip Module
An optionally available flip-chip module, which can be retrofitted at all times, enables all die bonders to place pre-flipped dice from waffle packs or picks them from wafers, flips and places them.

The Laser Bonder
picks up dice from pre-expanded wafers with up to 8", places them into a heated die nest, which moves the dice to predetermined positions under a flex tape. The dice are being pressed with programmable force and time against the underside of the tape. When the die bonded tape reaches the bonding stage, the machine pattern recognition unit identifies the bond pads automatically and moves the laser gun above each one in sequence. The laser fires through the tape and welds the gold pads on the bottom of the tape to the gold pads on the top of the die.


For more information on F&K Delvotec's die bonders please contact us or visit F&K Delvotec's web site.

Related Products & Categories: [Magazine Loaders]  [Wire Bonders]  [Inline Bonding Systems] [Carriers & Magazines]