F&K Delvotec has introduced a new series of linked wire bonders, capable of bonding up to 4 different wire sizes in one pass through the machine. Any combination of different sized gold wires, different sized aluminum wires or a combination of different sized gold and aluminum wires is possible, making the machine predestined for the production of power and smart power devices. Together with the option "intelligent input/output magazine handling system", as shown on the picture, these machines can be integrated into a fully automatic factory handling system.

F&K Delvotec has also introduced a new integrated line consisting of leadframe de-reeler, epoxy die bonder, leadframe singulator, cure oven, leadframe buffer, wire bonder and output magazine lift system. All components integrated into this line are designed and manufactured by F&K Delvotec and use the same hardware and software platforms, reducing the required spares holding drastically.