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Carriers, Magazines, Wafer Cassettes & Wafer Frames

Our own standard carriers for processing ceramic headers and metal can packages are suitable for most die & wire bonders and seam-sealers/cap-welders in the market, ensuring utmost flexibility at minimized downtime. The carriers are available either with 2-row-design (mostly used for headers with pins) or as matrix carriers up to 8" x 6" in size (mostly used for SMD ceramic headers). Suitable magazines are available as well.  .

For more information on our standard carriers and magazines please
contact us.

Related Products & Categories: [Die Bonders]  [Wire Bonders]  [Inline Bonding Systems]