UTK's model UP-800 is a Single Side Wafer Polishing Machine with 32" polishing plate and 4 air cylinder operated 12" pressure plates. It is designed for oxide and crystal wafers such as LT, LN, Quartz, Sapphire, etc. with up to 4" in diameter. Per program 3 pressures and speeds can set (max. 100 hours for each pressure). For double side lapped wafers with a TTV of less than 1mm the TTV of the finished wafer is just 2mm or less (requires wax mounting of wafers).

For more information on UTK's model UP-800 Single Side Wafer Polishing Machine please contact us.