UTK Wafer Scrub Cleaner




	UTK's series USC-100 is a family of fully automatic Double Side Scrub-Cleaning Machines designed for oxide and crystal wafers with up to 6" in diameter. Polishing slurry/abrasive rests, which cannot be removed by ultrasonic cleaning systems without taking the risk to damage the brittle wafers are removed by this system, giving the wafers an ultra clean and smooth surface. The machines with cassette to cassette material transport system

consist of 2 brushing stations and one drying station (spin type, final drying by means of N2 gas). The air in the cleaning chamber is cleaned by Class 10 ULPA filter elements to avoid surface scratches caused by particles.

For more information on UTK's USC-100 Double Side Scrub-Cleaning Machines please contact us.


	Related Products & Categories: [Brushes & Sponges] [Wafer Edge Grinder] [Edge Polishing Machine] [Universal Lapping & Polishing Machine] [Wafer Mounting Equipment] [Single Side Polishing Machine]