UTK's model UWB-150 C-Concept is a fully automatic Wafer Edge Grinder designed for 3" and 4" oxide and crystal wafers such as LT, LN, Quartz, Sapphire, etc. with one or more orientation and reference flats. The cassette to cassette material handling system includes a wafer transport robot as well as centering and orientation of wafer flat. A servomotor drives the 160mm diamond coated grinding-wheel, which is programmable up to 2,000 rpm.

For more information on UTK's UWB-150 C-Concept Series please contact us.