Wire Bonders




	The all new Wire Bonder family of F&K Delvotec has been developed from their highly successful, production proven models 6100, 6120, 6300 & 6500 and offer the best choice for a wide range of commercially and strategically important applications. Linear-motor-drive-systems ensure fast, smooth-running operation with unprecedented accuracy and repeatability in a very small footprint mainframe, ensuring efficient use of valuable clean room space.

The following models for different applications are available:

Model 6200
is a large area gold ball bonder for multi-chip module (MCM), hybrid and chip on board (COB) applications. The machine is equipped with Cognex^TM pattern recognition system and can handle wires with 17.5 to 50 microns diameter.

Model 6220
is a hig speed, large area gold ball bonder for leadframes, tapes, substrates and chip on board (COB). The machine is equipped with 256-gray-level Cognex^TM pattern recognition system and can handle wires with 17.5 to 50 microns diameter.

Model 6400
is a large area rotary head wedge bonder for all kinds of fine gold and aluminum wire applications. The machine is equipped with 256-gray-level Cognex^TM pattern recognition system and can handle wires with 17.5 to 75 microns diameter. It is ideal for applications such as hybrids, chip on board (COB), multi-chip modules (MCM) with chip to chip bonding, SAW filters, DVD pickup heads or Micro-X devices.

Model 6600
is a large area rotary head wedge bonder for all kinds of heavy aluminum wire applications. The machine is equipped with 256-gray-level Cognex^TM pattern recognition system and can handle wires with 100 to 500 microns diameter. It is ideal for applications such as leadframes, power modules, power hybrids and chip on board (COB).

Double, Triple and Four-Head Machines
Up to four identical or different Delvotec wire bonders can be linked to build a double, triple of even four-head wire bonder (see also "Inline Bonding Systems").

Manual and Semi-Automatic Wire Bonders
Beside the fully automatic machines, F&K Delvotec also produces manual and semi-automatic wire bonders, which are ideally suited for laboratories, pilot and pre-production runs as well as for repair lines. Available are the following models: 5410 semi-automatic gold ball bonder, 5430 semi-automatic fine gold & aluminum wire wedge bonder, 5450 semi-automatic heavy aluminum wire wedge bonder, 5405 manual gold ball bonder and 5425 manual fine gold & aluminum wire wedge bonder.

For more information on F&K Delvotec's wire bonders please contact us or visit F&K Delvotec's web site.


	Related Products & Categories: [Magazine Loaders] [Die Bonders] [Inline Bonding Systems] [Carriers & Magazines]